銅合金粉

CuZn40, also known as brass powder, is a copper-zinc alloy composed of 40% zinc and remainder copper. It offers an excellent combination of strength, ductility, corrosion resistance, machinability, and economical pricing making it one of the most widely used alloy powders. CuZn40 Powder Composition The composition of CuZn40 brass powder is: Element Composition Copper (Cu) Balance Zinc (Zn) 39-41% Copper forms the primary matrix imparting ductility and corrosion resistance. Zinc provides solid solution strengthening and improves machinability. This composition is referred as ‘Free machining brass’ or ‘High machinability brass’ owing to the enhancements from the 40% zinc content. Small additions of lead up to 0.5% may be present in some…

Overview of Pure Copper Powder Pure copper powder contains 99.5% or higher copper content. It provides excellent thermal and electrical conductivity combined with good corrosion resistance, solderability, and bio-compatibility. Key properties and advantages of pure copper powder: Pure Copper Powder Properties and Characteristics Properties Details Composition 99.5% or higher copper content Density 8.94 g/cc Particle shape Spherical, irregular Size range 1-150 microns Apparent density Up to 50% of true density Conductivity Excellent, second only to silver Solderability Excellent due to oxidation resistance Bio-compatibility High, safe for food contact Pure copper powder is ideal for applications like welding products, brazing alloys, friction materials, diamond tools, electrical contacts, and metal injection molding….

製品仕様 見掛密度 流動性 酸素含有量 引張強さ 降伏強さ 伸び CuCrZr 15-53μm 45-105μm 75-150μm Ô4.10g/cm3 ¨P30s/50g ¨P600ppm 350©I35Mpa 175©I10Mpa 8©I2% CuZn40 ¡4.25g/cm3 ¨P30s/50g ¨P600ppm CuSn10 ¡4.10g/cm3 ¨P30s/50g ¨P600ppm プロセス：真空空気噴霧法 利点印刷製品は熱伝導性、電気伝導性に優れ、設計と組み合わせることで、複雑な内部構造や冷却流路を持つ製品部品を製造することができる：航空宇宙エンジンのスラストチャンバーなどの部品、冷却効果の高い3Dプリント金型製品など。包装アルミホイル袋/プラスチックボトル/鉄製ドラム缶などの通常包装、真空包装、不活性ガス充填包装など。

CuCrZr粉末の概要 CuCrZr粉末は、銅（Cu）、クロム（Cr）、ジルコニウム（Zr）から成る合金粉末です。CuCrZr粉末は、高強度、良好な導電性、高温での耐軟化性を必要とする高性能用途に適した、ユニークな特性の組み合わせを提供します。CuCrZr粉末の組成 CuCrZrは析出硬化型合金であり、その高強度は金属マトリックス中に形成されたコヒーレントな析出物からもたらされる。組成は、最適な析出硬化反応を達成する上で重要な役割を果たします。以下に代表的な組成範囲を示す：銅 (Cu) 残部 クロム (Cr) 0.5 - 1.2 wt% ジルコニウム (Zr) 0.03 - 0.3 wt% 銅はマトリックスを形成し、...

Cu 99.95パウダーの概要 Cu 99.95パウダーは、電解タフピッチ（ETP）銅粉とも呼ばれ、99.95%以上の銅を含む高純度銅粉です。優れた電気伝導性と熱伝導性を持ち、機械的特性も優れています。主な用途は、電気接点、ブラシ、溶接製品、ろう付け、摩擦材、ダイヤモンド工具などです。Cu 99.95パウダーの主な特性と利点は以下の通りです：Cu 99.95パウダーの特性と特徴 特性の詳細 組成 最低銅量99.95% 密度 8.94 g/cc 粒子形状 不規則、角型 サイズ範囲 2-150ミクロン 見掛け密度 真密度の最大50% 流動性 低～中程度 導電性 優れた電気および熱伝導性 焼結性 良好...

Overview of CuSn10 Powder CuSn10 powder is a copper-tin alloy containing approximately 10% tin and the remainder copper. It offers an excellent combination of strength, ductility, corrosion resistance, wear resistance, and antifriction properties. Key properties and applications of CuSn10 powder include: CuSn10 Powder Properties and Characteristics Properties Details Composition 90% copper, 10% tin Density 8.8 g/cc Particle shape Irregular, angular Size range 5-150 microns Apparent density Up to 50% of true density Flowability Moderate Strength Excellent for Cu alloy powder Ductility Good Corrosion resistance Very good CuSn10 is widely used in bearing cages, bushings, welding rods, and wear parts across the automotive, electrical, and industrial sectors. CuSn10 Powder Composition Typical…

Product description Copper solder paste is prepared by a special process from copper-based brazing powder, trace active components, solvents, polymer carriers and other additives. Grades and specifications Model Product Type Composition(wt%) Powder Size(M) Brazing temperature(¡Í) Brazing method YTCu-1 Paste Cu:93:P:7 -200 -235 743-840 Furance, flame, resistance, High frequency brazing YTCu-2 Paste Cu:92.5;P:7.5 -200 -235 730-830 YTCu-3 Paste Cu:86;P:7;Sn:7 -200 -235 700-750 YTCu-4 Paste Cu:75;Sn;P;Ni, etc. -200 -235 600-650 9414 Powder Cu:88;Ni:5;Sn:7 -200 -235 890-900 1. Suitable for flame welding, resistance welding, high frequency welding and furnace welding between various copper and copper alloys. 2. Solder paste can be applied manually to the area to be soldered, and can also be…